Invention Grant
- Patent Title: Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same
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Application No.: US16279118Application Date: 2019-02-19
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Publication No.: US10685890B2Publication Date: 2020-06-16
- Inventor: Jongyoun Kim , Seokhyun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@16007b2e
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/498 ; H01L23/31 ; H01L25/10 ; H01L21/48 ; H01L23/538
Abstract:
A semiconductor package including a redistribution substrate, and a semiconductor chip mounted on the redistribution substrate, the semiconductor chip having a conductive pad on one surface thereof may be provided. The redistribution substrate may include a first passivation pattern on the conductive pad, the first passivation pattern exposing a portion of the conductive pad, and a redistribution pattern covering the portion of the conductive pad exposed by the first passivation pattern and surrounding the first passivation pattern.
Public/Granted literature
Information query
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