- 专利标题： Electronic device comprising a module connected to a PCB and electronic unit comprising such a device
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申请号： US16338388申请日： 2017-09-28
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公开(公告)号： US10681816B2公开(公告)日： 2020-06-09
- 发明人: François Guillot , Jean-Marc Blineau , Philippe Avignon , Serge Roques , Franck Albero
- 申请人： SAFRAN ELECTRONICS & DEFENSE , SAFRAN ELECTRICAL & POWER
- 申请人地址： FR Boulogne Billancourt
- 专利权人： Safran Electronics & Defense
- 当前专利权人： Safran Electronics & Defense
- 当前专利权人地址： FR Boulogne Billancourt
- 代理机构： Muncy, Geissler, Olds & Lowe, P.C.
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1523f4cd
- 国际申请： PCT/EP2017/074725 WO 20170928
- 国际公布： WO2018/060391 WO 20180405
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K1/18 ; B64D41/00 ; H01R12/58 ; H05K1/11 ; H05K3/00 ; H05K3/28 ; H05K3/34 ; H05K5/02 ; H05K7/14 ; H05K7/20
摘要：
A printed circuit board including at least one blind metal-plated hole, for receiving a pin of the printed circuit board being covered by a first layer of a protective film on which there extends a second layer of electrically insulating flexible material, the first layer and second layer are for piercing by the pins when they are engaged in the metal-plated holes, the first and second layers being for claming between a support of the pins and the printed circuit board. An electronic unit including such a device. A method of fabricating a printed circuit card for such a device.
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