- 专利标题： Thermal insulation material from mycelium and forestry byproducts
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申请号： US15418018申请日： 2017-01-27
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公开(公告)号： US10604734B2公开(公告)日： 2020-03-31
- 发明人: Philippe Amstislavski , Zhaohui Yang , Maria D. White
- 申请人： University of Alaska Anchorage
- 申请人地址： US AK Anchorage
- 专利权人： UNIVERSITY OF ALASKA ANCHORAGE
- 当前专利权人： UNIVERSITY OF ALASKA ANCHORAGE
- 当前专利权人地址： US AK Anchorage
- 代理机构： Ballard Spahr LLP
- 主分类号： C12N1/14
- IPC分类号： C12N1/14 ; E04B1/82 ; G10K11/162 ; E04B1/76 ; E04B1/74 ; E01C3/00 ; E01C3/06
摘要：
Disclosed are biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. Also disclosed are methods of making and using biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. For example, disclosed are methods of insulating an infrastructure comprising administering the disclosed biodegradable insulation materials to an infrastructure.
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