发明授权
- 专利标题： Semiconductor device, semiconductor chip, and test method for semiconductor chip
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申请号： US16243173申请日： 2019-01-09
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公开(公告)号： US10600698B2公开(公告)日： 2020-03-24
- 发明人: Hideki Masai
- 申请人： LAPIS Semiconductor Co., Ltd.
- 申请人地址： JP Yokohama
- 专利权人： LAPIS SEMICONDUCTOR CO., LTD.
- 当前专利权人： LAPIS SEMICONDUCTOR CO., LTD.
- 当前专利权人地址： JP Yokohama
- 代理机构： Rabin & Berdo, P.C.
- 优先权： JP2016-090323 20160428
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G01R31/28 ; G01R31/26 ; H01L23/522 ; H01L23/525 ; H01L23/00
摘要：
A semiconductor device includes a signal processing circuit configured to generate an output signal, an output pad, an output line connecting the signal processing circuit to the output pad, the output signal from the signal processing circuit being output from the output pad through the output line, a shorting pad formed in the output line, a switch connected between the shorting pad and the output pad, and configured to connect the signal processing circuit to the output pad when the switch is on, and disconnect the signal processing circuit from the output pad when the switch is off, and a wiring line connecting the shorting pad to the output pad.
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