- 专利标题： Semiconductor package and fabricating method thereof
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申请号： US15832027申请日： 2017-12-05
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公开(公告)号： US10586761B2公开(公告)日： 2020-03-10
- 发明人: Keun Soo Kim , Jae Yun Kim , Byoung Jun Ahn , Dong Soo Ryu , Dae Byoung Kang , Chel Woo Park
- 申请人： Amkor Technology, Inc.
- 申请人地址： US AZ Tempe
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 当前专利权人地址： US AZ Tempe
- 代理机构： McAndrews, Held & Malloy, Ltd.
- 优先权： KR10-2015-0017324 20150204
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/31 ; H01L25/10 ; H01L23/42 ; H01L23/433 ; H01L23/538
摘要：
A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.
公开/授权文献
- US20180096928A1 SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF 公开/授权日：2018-04-05
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