- 专利标题: Selective deposition of metal silicides
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申请号: US16189429申请日: 2018-11-13
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公开(公告)号: US10586707B2公开(公告)日: 2020-03-10
- 发明人: Raymond Hung , Namsung Kim , Srinivas D. Nemani , Ellie Y. Yieh , Jong Choi , Christopher Ahles , Andrew Kummel
- 申请人: Applied Materials, Inc. , The Regents of the University of California
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patterson + Sheridan, LLP
- 主分类号: H01L21/285
- IPC分类号: H01L21/285 ; H01L21/311 ; H01L21/324 ; C23C16/46 ; C23C16/42 ; C23C16/455 ; C23C16/04 ; C23C16/08 ; C23C16/02
摘要:
Embodiments of the disclosure relate to selective metal silicide deposition methods. In one embodiment, a substrate having a silicon containing surface is heated and the silicon containing surface is hydrogen terminated. The substrate is exposed to sequential cycles of a MoF6 precursor and a Si2H6 precursor which is followed by an additional Si2H6 overdose exposure to selectively deposit a MoSix material comprising MoSi2 on the silicon containing surface of the substrate. Methods described herein also provide for selective native oxide removal which enables removal of native oxide material without etching bulk oxide materials.
公开/授权文献
- US20190103278A1 SELECTIVE DEPOSITION OF METAL SILICIDES 公开/授权日:2019-04-04
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