Invention Grant
- Patent Title: COA substrate and manufacturing method thereof as well as display device
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Application No.: US15822694Application Date: 2017-11-27
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Publication No.: US10585317B2Publication Date: 2020-03-10
- Inventor: Zhicai Xu , Kui Zhang , Hui Li , Mengqiu Liu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Chongqing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chongqing
- Agency: Foley & Lardner LLP
- Agent James E. Ewing; Paul M. H. Pua
- Priority: CN201710210793 20170331
- Main IPC: G02F1/1362
- IPC: G02F1/1362 ; G02B5/20 ; G02F1/1345

Abstract:
The present disclosure relates to a COA substrate and a manufacturing method thereof, a display device. The COA substrate includes the following layers in a wiring region: a first conduction layer including a signal wire lead; an insulation layer having a first via to expose the signal wire lead; a second conduction layer including a first metal pattern with a second via; a flat layer having a hollowed-out region; and a connection pattern. The second via is at least in part located within the hollowed-out region, and orthographic projections of a border of a portion of the second via which is located within the hollowed-out region and a border of the first via on the base substrate overlap. The connection pattern extends through the first via and the second via and connects to the signal wire lead.
Public/Granted literature
- US20180284507A1 COA SUBSTRATE AND MANUFACTURING METHOD THEREOF AS WELL AS DISPLAY DEVICE Public/Granted day:2018-10-04
Information query
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