- 专利标题： Substrate cleaning apparatus and substrate processing apparatus
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申请号： US15946607申请日： 2018-04-05
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公开(公告)号： US10575697B2公开(公告)日： 2020-03-03
- 发明人: Akira Imamura , Junji Kunisawa , Mitsuru Miyazaki
- 申请人： EBARA CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： BakerHostetler
- 优先权： JP2017-076894 20170407
- 主分类号： B08B11/02
- IPC分类号： B08B11/02 ; H01L21/67 ; A47L11/18 ; B24B29/00 ; G05D3/20 ; G01C1/00 ; B24B37/34 ; B24B7/22 ; B24B27/00 ; B24B53/017 ; B24B37/10 ; B08B11/00
摘要：
Various examples of a substrate cleaning apparatus and a substrate processing apparatus are described in the present disclosure. One example of the present invention is a substrate cleaning apparatus including a roll cleaning member cleaning a substrate, an inclination sensor detecting an inclination of the roll cleaning member, and an output device outputting a detection result of the inclination sensor.
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