A kit for baking sandwich buns including a heat-resistant bottom baking pan having a plurality of recessed cylindrical bottom chambers. One of a plurality of cylindrical bowls is removably disposable within one of the plurality of recessed cylindrical bottom chambers of the heat-resistant bottom baking pan. A heat-resistant top baking pan has a plurality of recessed cylindrical top chambers. The heat-resistant top baking pan is removably disposed atop the heat-resistant bottom baking pan so that one of the plurality of recessed cylindrical top chambers of the heat-resistant top baking pan is disposed atop one of the plurality of recessed cylindrical bottom chambers of the heat-resistant bottom baking pan.