- 专利标题: Multilayer capacitor and board having the same
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申请号: US16004830申请日: 2018-06-11
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公开(公告)号: US10559424B2公开(公告)日: 2020-02-11
- 发明人: Jong Pil Lee , Hyo Youn Lee , Sung Kwon An , Seung Woo Song , Taek Jung Lee , Jin Kyung Joo
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2017-0113802 20170906
- 主分类号: H01G4/012
- IPC分类号: H01G4/012 ; H01G4/232 ; H01G4/248 ; H01G4/30 ; H05K1/18 ; H01G2/06 ; H01G4/12 ; H05K1/11
摘要:
A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
公开/授权文献
- US20190074137A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME 公开/授权日:2019-03-07
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