- 专利标题： MEMS microphone and method for manufacturing the same
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申请号： US15918256申请日： 2018-03-12
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公开(公告)号： US10547954B2公开(公告)日： 2020-01-28
- 发明人: Hui Shi
- 申请人： SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION , SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- 申请人地址： CN Shanghai CN Beijing
- 专利权人： SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- 当前专利权人： SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION,SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
- 当前专利权人地址： CN Shanghai CN Beijing
- 代理机构： Kilpatrick Townsend & Stockton LLP
- 优先权： CN201710148001 20170313
- 主分类号： H04R19/04
- IPC分类号： H04R19/04 ; B81B3/00 ; B81C1/00 ; H04R19/00 ; B81B7/00 ; B81B7/02
摘要：
A microphone includes a substrate, an opening in the substrate, and a support structure in the opening. The support structure includes a first bracket formed in a closed-loop pattern and a second bracket connecting the first bracket to a periphery of the opening. The support structure in the opening increases the mechanical reliability of the microphone.
公开/授权文献
- US20180262845A1 MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME 公开/授权日：2018-09-13
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