- 专利标题： Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric
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申请号： US15777040申请日： 2015-12-22
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公开(公告)号： US10546835B2公开(公告)日： 2020-01-28
- 发明人: Vijay K. Nair , Georgios C. Dogiamis , Telesphor Kamgaing
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Schwabe, Williamson & Wyatt, P.C.
- 国际申请： PCT/US2015/000159 WO 20151222
- 国际公布： WO2017/111768 WO 20170629
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/66 ; H01L25/10 ; H01L23/00
摘要：
Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.
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