- 专利标题： Manufacturing process of element chip and substrate heating apparatus
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申请号： US16008280申请日： 2018-06-14
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公开(公告)号： US10546783B2公开(公告)日： 2020-01-28
- 发明人: Noriyuki Matsubara , Hidehiko Karasaki
- 申请人： Panasonic Intellectual Property Management Co., Ltd.
- 申请人地址： JP Osaka
- 专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人地址： JP Osaka
- 代理机构： Pearne & Gordon LLP
- 优先权： JP2017-126365 20170628
- 主分类号： H01L21/82
- IPC分类号： H01L21/82 ; H01L21/683 ; B23K26/364 ; H01L21/67 ; H01L21/308 ; H01L21/3065
摘要：
Provided is a manufacturing process of an element chip, which comprises a preparing step for preparing a substrate containing element regions and dicing regions, a holding step for holding the substrate and a frame with a holding sheet, an applicating step for applying a resin material solution containing a resin constituent and a solvent on the substrate to form a coated layer containing the resin constituent and the solvent thereon, a heating step for heating the substrate held on the holding sheet through a heat shielding member shielding the frame and the holding sheet to substantially remove the solvent from the coated layer, thereby to form a resin layer, a patterning step for patterning the resin layer to expose the substrate in the dicing regions, and a dicing step for dicing the substrate into element chips by plasma-etching the substrate.
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