发明授权
- 专利标题: Fuse production method, fuse, circuit board production method and circuit board
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申请号: US15726373申请日: 2017-10-05
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公开(公告)号: US10546710B2公开(公告)日: 2020-01-28
- 发明人: Toshitaka Ogawa
- 申请人: SOC Corporation
- 申请人地址: JP Tokyo
- 专利权人: SOC Corporation
- 当前专利权人: SOC Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: JCIPRNET
- 主分类号: H01H85/055
- IPC分类号: H01H85/055 ; H01H85/02 ; H01H85/046 ; H01H69/02 ; H05K1/03 ; H05K1/09 ; H05K3/10
摘要:
A fuse production method includes the steps of forming a liquid film of a dispersion liquid, in which metal nanoparticles are dispersed in a solvent, on a principal surface of a substrate containing at least an organic substance, heating the liquid film so as to vaporize the solvent to melt or sinter the metal nanoparticles and to soften or melt the principal surface, and forming a fuse film on the principal surface by fusing the melted or sintered metal nanoparticles and the softened or melted principal surface with each other.
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