A component attachment apparatus picks up a first component supplied to supply position of a first stick feeder with a head, assembles the first component and a second component by inserting a lead of the first component held by the head into an insertion hole of the second component supplied to supply position of a second stick feeder, and then attaches the assembly to a board. Therefore, in comparison with a case where the first component attached to the second component after the second component is attached to the board, it is possible to stably attach the components to the board with low influence of warping of the board.