A reflow soldering apparatus, system, and method. The reflow soldering system may include a housing that is alterable between an open state and a closed state, the open state being used for loading and unloading of substrates and the closed state being used during operation. The system may also include a heating assembly located within the chamber and a cooling assembly that is spaced apart from the heating assembly. A support member may be included to support a substrate within the chamber. A first actuator unit may be operably coupled to either the heating and cooling assemblies jointly, or to the support member. Additionally, the system may include a control unit coupled to the first actuator unit to cause relative movement between the substrate and the heating and cooling assemblies. Thus, the substrate can move between the heating and cooling assemblies during the various stages of the reflow soldering process.