- 专利标题: Distributed electro-static chuck cooling
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申请号: US13863226申请日: 2013-04-15
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公开(公告)号: US10537013B2公开(公告)日: 2020-01-14
- 发明人: Fernando Silveira , Richard Fovell , Hamid Tavassoli
- 申请人: APPLIED MATERIALS, INC.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H05H1/00
- IPC分类号: H05H1/00
摘要:
Embodiments of the invention include an apparatus, system, and method for cooling a pedestal for supporting a workpiece during plasma processing. An embodiment of a pedestal includes: a base over which the workpiece is to be disposed, a plurality of nozzles to supply a fluid from a supply plenum to impinge on a surface of the base, and a plurality of return conduits to return the supplied fluid to a return plenum. The fluid to be supplied by the plurality of nozzles can be projected as one or more jets submerged in surrounding fluid or as a spray that emerges from a surrounding fluid within a volume between the plurality of nozzles and the base to impinge on the surface of the base.
公开/授权文献
- US20130276981A1 DISTRIBUTED ELECTRO-STATIC CHUCK COOLING 公开/授权日:2013-10-24
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