- 专利标题: Overlapping cluster architecture for coordinated multipoint (CoMP)
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申请号: US15684823申请日: 2017-08-23
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公开(公告)号: US10536195B2公开(公告)日: 2020-01-14
- 发明人: Jing Sun , Xiaoxia Zhang , Taesang Yoo , Siddhartha Mallik , Juan Montojo
- 申请人: QUALCOMM Incorporated
- 申请人地址: US CA San Diego
- 专利权人: QUALCOMM Incorporated
- 当前专利权人: QUALCOMM Incorporated
- 当前专利权人地址: US CA San Diego
- 代理机构: Patterson & Sheridan, LLP
- 主分类号: H04H20/71
- IPC分类号: H04H20/71 ; H04B7/024 ; H04L12/715 ; H04B17/318 ; H04B7/06 ; H04L5/00 ; H04W56/00
摘要:
Techniques for overlapping cluster architecture for coordinated multipoint (CoMP) are provided. According to certain aspects, a method of wireless communication by a transmission point is provided. The method generally includes receiving, from a first base station, a first signal for a first user equipment (UE) to transmit over the air, receiving, from a second base station, a second signal for a second UE to transmit over the air, and combining the first and the second signals from the first and second base stations and transmitting the combined signal to the first and second UE.
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