- 专利标题: Optimized partitioning of solid 3D models for additive manufacturing
-
申请号: US15539917申请日: 2016-01-21
-
公开(公告)号: US10534875B2公开(公告)日: 2020-01-14
- 发明人: Erhan Arisoy , Suraj Ravi Musuvathy , Lucia Mirabella , Sanjeev Srivastava , Livio Dalloro
- 申请人: Siemens Product Lifecycle Management Software, Inc
- 申请人地址: US TX Plano
- 专利权人: SIEMENS INDUSTRY SOFTWARE INC.
- 当前专利权人: SIEMENS INDUSTRY SOFTWARE INC.
- 当前专利权人地址: US TX Plano
- 国际申请: PCT/US2016/014208 WO 20160121
- 国际公布: WO2016/118682 WO 20160728
- 主分类号: G06F17/50
- IPC分类号: G06F17/50 ; B33Y50/00 ; G06T17/00 ; B33Y10/00
摘要:
A method of partitioning a model to facilitate printing of the model on a 3D printer includes identifying partition sensitive locations on the model and creating a binary tree with a root note representative of the model. An iterative partitioning process is applied to divide the model into objects by selecting a node of the binary tree without any children nodes, identifying a portion of the model corresponding to the node, and determining candidate cutting planes on the portion of the model based on the partition sensitive locations. During the process, analytic hierarchical processing (AHP) is applied to select an optimal cutting plane from the candidate cutting planes based on partitioning criteria. The optimal cutting plane is used to segment the portion of the model into sub-portions, and two children nodes representative of these sub-portions are created on the node of the binary tree.
公开/授权文献
信息查询