- 专利标题: Resin filling device and resin filling method for magnet embedded core
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申请号: US15555337申请日: 2015-05-08
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公开(公告)号: US10532501B2公开(公告)日: 2020-01-14
- 发明人: Hironobu Okudaira , Tomoaki Murayama , Osamu Fukuyama
- 申请人: KURODA PRECISION INDUSTRIES LTD.
- 申请人地址: JP Kanagawa
- 专利权人: KURODA PRECISION INDUSTRIES LTD.
- 当前专利权人: KURODA PRECISION INDUSTRIES LTD.
- 当前专利权人地址: JP Kanagawa
- 代理机构: Dority & Manning, P.A.
- 国际申请: PCT/JP2015/002356 WO 20150508
- 国际公布: WO2016/181421 WO 20161117
- 主分类号: B29C45/14
- IPC分类号: B29C45/14 ; B29C45/34 ; H02K15/03 ; B29C45/27 ; B29L31/00 ; H02K1/27
摘要:
A resin filling device includes: a first mold and a second mold provided so as to face each other to sandwich therebetween a laminated iron core and thereby to fix the laminated iron core; a flow path forming member provided to the first mold so as to be engageable with one of the axial ends of the laminated iron core and forming a resin flow path through which a resin flows; and a fitting member provided to the second mold to be fitted into an opening portion of the flow path forming member that is in communication with the resin flow path, wherein the fitting member is provided with a vent portion for discharging air in the resin flow path to outside.
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