- 专利标题: Charge carrier transport facilitated by strain
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申请号: US15964765申请日: 2018-04-27
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公开(公告)号: US10529855B2公开(公告)日: 2020-01-07
- 发明人: Anirban Basu , Guy M. Cohen
- 申请人: International Business Machines Corporation
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Isaac J. Gooshaw
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L29/78 ; H01L29/205 ; H01L29/04 ; H01L21/306 ; H01L29/66 ; H01L21/02 ; H01L29/08 ; H01L29/20 ; H01L29/423
摘要:
A semiconductor structure and formation thereof. The semiconductor structure has a first semiconductor layer with a first lattice structure and a second epitaxial semiconductor layer that is lattice-matched with the first semiconductor layer. At least two source/drain regions, which have a second lattice structure, penetrate the second semiconductor layer and contact the first semiconductor layer. A portion of the second semiconductor layer is between the source/drain regions and has a degree of uniaxial strain that is based, at least in part, on a difference between the first lattice structure and the second lattice structure.
公开/授权文献
- US20180248040A1 CHARGE CARRIER TRANSPORT FACILITATED BY STRAIN 公开/授权日:2018-08-30
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