发明授权
- 专利标题： Substrate position adjustment method, storage medium and substrate treatment system
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申请号： US16026680申请日： 2018-07-03
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公开(公告)号： US10529604B2公开(公告)日： 2020-01-07
- 发明人: Makoto Hayakawa
- 申请人： Tokyo Electron Limited
- 申请人地址： JP Tokyo
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 当前专利权人地址： JP Tokyo
- 代理机构： Posz Law Group, PLC
- 优先权： JP2017-138264 20170714
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/687 ; G03F7/16 ; G03F7/09 ; G06T7/00 ; G03F7/30
摘要：
The method includes a step of executing a rotation treatment in a rotation treatment apparatus; a step of imaging a substrate on which the rotation treatment has been executed, in an inspection apparatus; a step of acquiring change amount information stored in advance, being information on an amount of change in orientation of the substrate while the substrate is moved from the rotation treatment apparatus to the inspection apparatus; a step of acquiring, as an execution result information, information on an execution result of the rotation treatment along a circumferential direction of the substrate, based on an imaging result in the inspection apparatus; and a step of correcting a position of the substrate at a time of the rotation treatment, based on the change amount information and the execution result information.
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