- 专利标题: Electronic component
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申请号: US15828472申请日: 2017-12-01
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公开(公告)号: US10529488B2公开(公告)日: 2020-01-07
- 发明人: Yukihiro Fujita , Takashi Fukuma
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人: MURATA MANUFACTURING CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Keating & Bennett, LLP
- 优先权: JP2016-235075 20161202
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G2/06 ; H01G4/232 ; H01G4/005 ; H01G4/12 ; H05K1/11 ; H05K1/18 ; H05K1/02
摘要:
An electronic component includes a multilayer capacitor and an interposer including a substrate main body with an electric insulation property, the multilayer capacitor being mounted on one main surface side of the substrate main body. The multilayer capacitor includes a multilayer body, a first outer electrode, and a second outer electrode. The multilayer body includes an effective region and a non-effective region surrounding the effective region. A width of the effective region is larger than a width of the substrate main body, when a width of the multilayer body is represented by W11, a thickness of the multilayer body is represented by T11, and a thickness of the substrate main body is represented by T21, a value of W11/(T11+T21) is not less than about 0.90 and not more than about 1.10.
公开/授权文献
- US20180158608A1 ELECTRONIC COMPONENT 公开/授权日:2018-06-07
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