- 专利标题： Engineered substrate structure
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申请号： US15621338申请日： 2017-06-13
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公开(公告)号： US10510582B2公开(公告)日： 2019-12-17
- 发明人: Vladimir Odnoblyudov , Cem Basceri , Shari Farrens
- 申请人： QROMIS, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Qromis, Inc.
- 当前专利权人： Qromis, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Kilpatrick Townsend & Stockton LLP
- 主分类号： B32B9/00
- IPC分类号： B32B9/00 ; H01L21/762 ; H01L29/06 ; H01L21/48 ; H01L21/02 ; H01L21/311
摘要：
A substrate includes a polycrystalline ceramic core; a first adhesion layer encapsulating the polycrystalline ceramic core; a conductive layer encapsulating the first adhesion layer; a second adhesion layer encapsulating the conductive layer; a barrier layer encapsulating the second adhesion layer, and a bonding layer coupled to the barrier layer, and a substantially single crystalline silicon layer coupled to the bonding layer.
公开/授权文献
- US20180047618A1 ENGINEERED SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURE 公开/授权日：2018-02-15
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