- 专利标题: Photonic integration platform
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申请号: US16052524申请日: 2018-08-01
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公开(公告)号: US10509174B2公开(公告)日: 2019-12-17
- 发明人: Mark Webster , Ravi Sekhar Tummidi
- 申请人: Cisco Technology, Inc.
- 申请人地址: US CA San Jose
- 专利权人: Cisco Technology, Inc.
- 当前专利权人: Cisco Technology, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Patterson + Sheridan, LLP
- 主分类号: G02B6/35
- IPC分类号: G02B6/35 ; G02B6/12 ; B81B5/00 ; G02B6/30 ; G02B6/122 ; G02B6/14 ; G02B6/132 ; G02B6/10 ; G02B6/43
摘要:
A SOI device may include a waveguide adapter that couples light between an external light source—e.g., a fiber optic cable or laser—and a silicon waveguide on the silicon surface layer of the SOI device. In one embodiment, the waveguide adapter is embedded into the insulator layer. Doing so may enable the waveguide adapter to be formed before the surface layer components are added onto the SOI device. Accordingly, fabrication techniques that use high-temperatures may be used without harming other components in the SOI device—e.g., the waveguide adapter is formed before heat-sensitive components are added to the silicon surface layer.
公开/授权文献
- US20180341064A1 PHOTONIC INTEGRATION PLATFORM 公开/授权日:2018-11-29
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