- 专利标题: Cooler and flow path unit
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申请号: US15427364申请日: 2017-02-08
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公开(公告)号: US10433457B2公开(公告)日: 2019-10-01
- 发明人: Tomoyoshi Kobayashi , Koji Hachiya , Eiji Shimoyama
- 申请人: Tomoyoshi Kobayashi , Koji Hachiya , Eiji Shimoyama
- 申请人地址: JP Kyoto
- 专利权人: OMRON CORPORATION
- 当前专利权人: OMRON CORPORATION
- 当前专利权人地址: JP Kyoto
- 代理机构: Osha Liang LLP
- 优先权: JP2016-023279 20160210
- 主分类号: F28D15/00
- IPC分类号: F28D15/00 ; F28F13/12 ; F28F7/00 ; H05K7/20 ; F28F1/02 ; F28F1/40 ; F28F3/12 ; F28F9/02 ; H01L23/473 ; F28F9/22 ; F28D21/00
摘要:
A cooler includes: a narrow flow path that has a narrow cross-sectional area; a wide flow path that is connected to a downstream side of the narrow flow path, is in thermal contact with a heating body, and has a wide cross-sectional area; and at least one rectifying piece that is provided in an upstream portion of the wide flow path that is an upstream side from a position being in thermal contact with the heating body. A fluid refrigerant flows through the narrow flow path and the wide flow path, and heat generated by the heating body is radiated. The rectifying piece includes: a single first angle portion that protrudes toward the upstream side; and a first surface and a second surface that join at an acute angle to form the first angle portion.
公开/授权文献
- US10292306B2 Cooler and flow path unit 公开/授权日:2019-05-14
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