Invention Grant
- Patent Title: Liquid ejecting head chip, liquid ejecting head, and liquid ejecting apparatus
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Application No.: US15883837Application Date: 2018-01-30
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Publication No.: US10427404B2Publication Date: 2019-10-01
- Inventor: Yuzuru Kubota , Daichi Nishikawa
- Applicant: SII Printek Inc.
- Applicant Address: JP Chiba-Shi, Chiba
- Assignee: SII PRINTEK INC.
- Current Assignee: SII PRINTEK INC.
- Current Assignee Address: JP Chiba-Shi, Chiba
- Agency: Brinks Gilson & Lione
- Priority: JP2017-018234 20170203
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16 ; B41J2/145 ; B41J2/155 ; H01L41/047 ; H01L41/09 ; H01L41/187 ; H01L41/29 ; H01L41/332 ; H01L41/338

Abstract:
According to an embodiment, a liquid ejecting head chip includes an actuator plate, a cover plate, a common electrode, and a connection wiring. In the actuator plate, a plurality of discharge channels and a plurality of non-discharge channels which extend in a Z-direction are alternately arranged at a distance in an X-direction. The cover plate is stacked on an AP-side-Y-direction inner side surface, so as to close the plurality of discharge channels and the plurality of non-discharge channels. The common electrode is formed on an inner surface of each of the discharge channels. The connection wiring is divided so as to be formed in at least 3 or more places in the X-direction on the cover plate, and the common electrode connects the connection wiring to the flexible substrate.
Public/Granted literature
- US20180222195A1 LIQUID EJECTING HEAD CHIP, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS Public/Granted day:2018-08-09
Information query
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