Invention Grant
- Patent Title: Determining critical parameters using a high-dimensional variable selection model
-
Application No.: US14955752Application Date: 2015-12-01
-
Publication No.: US10361105B2Publication Date: 2019-07-23
- Inventor: Wei Chang , Joseph Gutierrez , Krishna Rao
- Applicant: KLA-TENCOR CORPORATION
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Hodgson Russ LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G06N7/00 ; G05B19/418

Abstract:
A high-dimensional variable selection unit determines a list of critical parameters from sensor data and parametric tool measurements from a semiconductor manufacturing tool, such as a semiconductor inspection tool or other types of semiconductor manufacturing tools. The high-dimensional variable selection model can be, for example, elastic net, forward-stagewise regression, or least angle regression. The list of critical parameters may be used to design a next generation semiconductor manufacturing tool, to bring the semiconductor manufacturing tool back to a normal status, to match a semiconductor manufacturing tool's results with that of another semiconductor manufacturing tool, or to develop a specification for the semiconductor manufacturing tool.
Public/Granted literature
- US20160163574A1 DETERMINING CRITICAL PARAMETERS USING A HIGH-DIMENSIONAL VARIABLE SELECTION MODEL Public/Granted day:2016-06-09
Information query
IPC分类: