Invention Grant
- Patent Title: Low temperature poly silicon backboard, method for manufacturing the same and light-emitting device
-
Application No.: US15104551Application Date: 2015-10-15
-
Publication No.: US10347532B2Publication Date: 2019-07-09
- Inventor: Xiaowei Xu , Libin Liu , Liangjian Li , Chunping Long
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201510350257 20150623
- International Application: PCT/CN2015/091959 WO 20151015
- International Announcement: WO2016/206236 WO 20161229
- Main IPC: H01L21/77
- IPC: H01L21/77 ; H01L23/552 ; H01L27/12 ; H01L27/32
Abstract:
The present disclosure provides a Low Temperature Poly Silicon (LTPS) backboard, a method for manufacturing the LTPS, and a light-emitting device. The LTPS backboard includes: a base substrate, and a thin film transistor (TFT) and a light blocking layer that are arranged above the base substrate, wherein the light blocking layer is arranged above the TFT, and the light blocking layer is configured for preventing an irradiation light from irradiating onto the TFT.
Public/Granted literature
- US20180204769A1 LOW TEMPERATURE POLY SILICON BACKBOARD, METHOD FOR MANUFACTURING THE SAME AND LIGHT-EMITTING DEVICE Public/Granted day:2018-07-19
Information query
IPC分类:
