- 专利标题: Substrate processing apparatus
-
申请号: US15051034申请日: 2016-02-23
-
公开(公告)号: US10297476B2公开(公告)日: 2019-05-21
- 发明人: Jun Sawashima , Akito Hatano , Kenji Kobayashi , Yuta Nishimura , Motoyuki Shimai , Toyohide Hayashi
- 申请人: SCREEN Holdings Co., Ltd.
- 申请人地址: JP
- 专利权人: SCREEN Holdings Co., Ltd.
- 当前专利权人: SCREEN Holdings Co., Ltd.
- 当前专利权人地址: JP
- 代理机构: Ostrolenk Faber LLP
- 优先权: JP2015-35517 20150225; JP2015-35518 20150225
- 主分类号: H01L21/67
- IPC分类号: H01L21/67
摘要:
A supply flow passage branches into a plurality of upstream flow passages. A plurality of discharge ports are respectively disposed at a plurality of positions differing in distance from a rotational axis of a substrate. A return flow passage is connected to the upstream flow passage. A downstream heater heats liquid flowing through the upstream flow passage. A downstream switching unit supplies the liquid, supplied to the plurality of upstream flow passages from the supply flow passage, to one of the plurality of discharge ports and the return flow passage, selectively.
公开/授权文献
- US20160247697A1 SUBSTRATE PROCESSING APPARATUS 公开/授权日:2016-08-25
信息查询
IPC分类: