- 专利标题： Semiconductor arrangement in fan out packaging including magnetic structure around transmission line
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申请号： US15464953申请日： 2017-03-21
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公开(公告)号： US10276518B2公开(公告)日： 2019-04-30
- 发明人: Wen-Shiang Liao , Huan-Neng Chen
- 申请人： Taiwan Semiconductor Manufacturing Company Limited
- 申请人地址： TW Hsin-chu
- 专利权人： Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人： Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人地址： TW Hsin-chu
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L23/66 ; H01L23/48 ; H01L21/768 ; H03F3/195
摘要：
A semiconductor arrangement in fan out packaging has a molding compound adjacent a side of a semiconductor die. A magnetic structure is disposed above the molding compound, above the semiconductor die, and around a transmission line coupled to an integrated circuit of the semiconductor die. The magnetic structure has a top magnetic portion, a bottom magnetic portion, a first side magnetic portion, and a second side magnetic portion. The first side magnetic portion and the second side magnetic portion are coupled to the top magnetic portion and to the bottom magnetic portion. The first side magnetic portion and the second side magnetic portion have tapered sidewalls.
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