- 专利标题： Silicon wafer pre-alignment device and method therefor
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申请号： US15109040申请日： 2014-12-26
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公开(公告)号： US10276418B2公开(公告)日： 2019-04-30
- 发明人: Weiwang Sun , Gang Wang , Chunxia Huang , Songli Hu , Jie Jiang , Ruzhan Lu , Jiyuan Mou
- 申请人： SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
- 申请人地址： CN Shanghai
- 专利权人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- 当前专利权人： SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- 当前专利权人地址： CN Shanghai
- 代理机构： Muncy, Geissler, Olds & Lowe, P.C.
- 优先权： CN201310752191 20131231; CN201410367501 20140729
- 国际申请： PCT/CN2014/095105 WO 20141226
- 国际公布： WO2015/101220 WO 20150709
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/68 ; H01L21/683 ; H01L21/687 ; H01L21/66
摘要：
A wafer pre-alignment device is disclosed, including a first unit configured to drive a wafer to rotate or move upward or downward, a second unit configured to drive the wafer to translate, and a position detector including a light source, a lens and an image sensor. A light beam from the light source passes through the wafer and the lens and thereby provides information indicating a position of the wafer to the image sensor. The first unit and the second unit are able to adjust the position of the wafer based on the information obtained by the image sensor. A method for pre-aligning a TSV wafer is also disclosed.
公开/授权文献
- US20160329229A1 Silicon Wafer Pre-alignment Device and Method Therefor 公开/授权日：2016-11-10
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