- 专利标题: Method for reducing conductor track spacing in electronic circuit boards and electronic circuit board with reduced spacing between conductor tracks
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申请号: US15773205申请日: 2016-10-19
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公开(公告)号: US10257922B2公开(公告)日: 2019-04-09
- 发明人: Peter Hummel , Stefan Mannhardt
- 申请人: OSRAM GmbH
- 申请人地址: DE Munich
- 专利权人: OSRAM GMBH
- 当前专利权人: OSRAM GMBH
- 当前专利权人地址: DE Munich
- 代理机构: Viering, Jentschura & Partner MBB
- 优先权: DE102015221688 20151105
- 国际申请: PCT/EP2016/075049 WO 20161019
- 国际公布: WO2017/076641 WO 20170511
- 主分类号: H05K7/02
- IPC分类号: H05K7/02 ; H02H9/04 ; H05K1/02 ; F21Y115/10 ; F21V23/02
摘要:
A method for reducing conductor track spacings in a printed circuit board, wherein the printed circuit board has an input part, wherein the input part is fed by a supply voltage, and has an output part, comprising the following steps: inserting an intermediate conductor track which has an intermediate potential derived from the input part, maintaining a functional insulation gap between the intermediate conductor track and adjacent conductor tracks of the input part, maintaining a safety-relevant insulation gap between the intermediate conductor track and the adjacent conductor tracks of the output part. The intermediate potential has, with respect to adjacent conductor tracks of the output part, a voltage which corresponds at most to the supply voltage of the input part.
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