Invention Grant
- Patent Title: Cooling module
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Application No.: US15520486Application Date: 2015-11-13
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Publication No.: US10253729B2Publication Date: 2019-04-09
- Inventor: Shingo Oono , Tomohiro Shimazu , Yasuhiro Mizuno , Ryohei Tomita
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya, Aichi-pref.
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya, Aichi-pref.
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2014-235448 20141120; JP2015-120462 20150615
- International Application: PCT/JP2015/005683 WO 20151113
- International Announcement: WO2016/079970 WO 20160526
- Main IPC: F02M26/32
- IPC: F02M26/32 ; F01P3/18 ; F02B29/04 ; F28F21/00 ; H01L23/36 ; H01L23/433 ; H01L23/473

Abstract:
A cooling module has a heat generating body, a heat exchanger made of metal, and an insulating plate. The heat generating body has a heat dissipating surface. The heat exchanger has cooling surface facing the heat dissipating surface. The insulating plate has a first surface and a second surface. The insulating plate is interposed between the heat dissipating surface and the cooling surface on a condition that the insulating plate faces the heat dissipating surface and that the second surface faces the cooling surface. The insulating plate and the cooling surface are joined to be one body by a joining material. The heat dissipating surface and the insulating plate are in close contact with each other through an elastic member. The heat dissipating surface and the cooling surface are thermally connected to each other through the joining material, the insulating plate, and the elastic member.
Public/Granted literature
- US20170314515A1 COOLING MODULE Public/Granted day:2017-11-02
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