Invention Grant
- Patent Title: Probe tip and probe assembly
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Application No.: US15806270Application Date: 2017-11-07
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Publication No.: US10241133B2Publication Date: 2019-03-26
- Inventor: Julie A. Campbell , William A. Hagerup , Ira G. Pollock , Christina D. Enns , James E. Spinar , Kathleen F. M. Ullom , Charles M. Hartmann , Daniel J. Ayres
- Applicant: Tektronix, Inc.
- Applicant Address: US OR Beaverton
- Assignee: Tektronix, Inc.
- Current Assignee: Tektronix, Inc.
- Current Assignee Address: US OR Beaverton
- Agent Kevin D. Dothager
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G01R1/067 ; H01R13/24 ; C12Q1/00 ; G01R1/073 ; G05G1/00 ; H01R101/00

Abstract:
A test probe tip can include a resistive element coupled with a tip component. The resistive element can include a resistive layer disposed on an exterior surface of a structural member of the resistive impedance element. In embodiments, the resistive element can be configured to form a structural component of the test probe tip without an insulating covering applied thereto. Additional embodiments may be described and/or claimed herein.
Public/Granted literature
- US20180059139A1 PROBE TIP AND PROBE ASSEMBLY Public/Granted day:2018-03-01
Information query
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