发明授权
- 专利标题： Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer
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申请号： US15578701申请日： 2016-06-01
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公开(公告)号： US10159142B2公开(公告)日： 2018-12-18
- 发明人: Yuusuke Haruna , Hiroshi Tajima , Masahiro Watanabe , Yukari Kobayashi , Kiyoharu Sekiguchi , Yoshihiro Hosoya
- 申请人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD. , TOKUSHU KINZOKU EXCEL CO., LTD.
- 申请人地址： JP Osaka
- 专利权人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- 当前专利权人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- 当前专利权人地址： JP Osaka
- 代理机构： Potomac Law Group, PLLC
- 优先权： JP2015-112296 20150602
- 国际申请： PCT/JP2016/066190 WO 20160601
- 国际公布： WO2016/194950 WO 20161208
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; B23K20/02 ; B23K20/00 ; B23K20/24 ; B23K35/00 ; B23K35/02 ; B23K1/19 ; H05K3/32 ; H05K1/09 ; H05K1/18 ; B23K20/16 ; B23K20/227 ; B23K101/42 ; B23K103/04 ; B23K103/18
摘要：
A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.
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