- 专利标题： Method for forming a passive device on a package-on-package structure
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申请号： US15133326申请日： 2016-04-20
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公开(公告)号： US10157829B2公开(公告)日： 2018-12-18
- 发明人: Chih-Hua Chen , Chen-Shien Chen
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L25/10 ; H01L25/16 ; H01L23/64 ; H01L21/683 ; H01L23/498 ; H01L23/538 ; H01L23/00 ; H01L21/48 ; H01L23/31 ; H01L21/56 ; H01L21/60
摘要：
A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs.
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