A chip-type electronic component 1a mounted on a board includes a chip element assembly 2 having an upper surface, a lower surface, and a side surface; inner electrodes 3a, 3b, and 3c formed inside the chip element assembly 2; and a cover layer 5 that is formed with an insulation material having a lower permittivity than the chip element assembly 2 and is so provided as to cover at least part of the side surface of the chip element assembly 2. With this structure, unnecessary stray capacitance between the inner electrodes 3a, 3b, and 3c formed inside the chip element assembly 2 and other electrode members arranged outside the cover layer 5 in a direction orthogonal to a thickness direction of the chip element assembly 2 can be reduced, whereby the chip-type electronic component 1a capable of realizing the desired characteristics can be provided.