Disclosed herein is an electronic display assembly including a backlight that is positioned to illuminate a liquid crystal display, and a novel cooling mechanism in the form of a thermal plate that is located and configured to transfer heat from the backlight to a thermally conductive housing of the electronic display assembly. The thermal plate is preferably placed in conductive thermal communication with the backlight and with the thermally conductive housing for this purpose. One or more air flow apertures may pass through the thermal plate. A convective cooling loop may also be provided, which cooling loop may include a fan that is located to move cooling air over the thermal plate and/or though one or more apertures in the thermal plate. Both a top and bottom thermal plate may be employed in some exemplary embodiments.