- 专利标题： Surface nitridation in metal interconnects
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申请号： US15444933申请日： 2017-02-28
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公开(公告)号： US10068846B2公开(公告)日： 2018-09-04
- 发明人: Lawrence A. Clevenger , Roger A. Quon , Terry A. Spooner , Wei Wang , Chih-Chao Yang
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理机构： Tutunjian & Bitetto, P.C.
- 代理商 Vazken Alexanian
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L21/768 ; H01L21/311
摘要：
Conductive contacts include a first conductor disposed within a first dielectric layer, the first conductor having a recessed area in least one surface. A second dielectric layer is formed over the first dielectric layer, comprising a trench positioned over the first conductor. A second conductor is formed in the trench and the recessed area to form a conductive contact with the first conductor.
公开/授权文献
- US20180082945A1 SURFACE NITRIDATION IN METAL INTERCONNECTS 公开/授权日：2018-03-22
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