- 专利标题: Multilayer capacitor and board having the same
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申请号: US15467686申请日: 2017-03-23
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公开(公告)号: US10057988B2公开(公告)日: 2018-08-21
- 发明人: Young Ghyu Ahn , Byoung Hwa Lee
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si, Gyeonggi-Do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2016-0088481 20160713
- 主分类号: H01G4/228
- IPC分类号: H01G4/228 ; H05K1/18 ; H05K1/11 ; H01G4/30 ; H01G4/018 ; H01G4/012 ; H01G4/248
摘要:
A multilayer capacitor and a board having the same includes external electrodes and internal electrodes. The external electrodes include connection portions formed on a mounting surface of a capacitor body and band portions formed on side surfaces of the capacitor body, and the internal electrodes include body portions overlapping each other and lead portions extended from the body portions to the mounting surface of the capacitor body, to thereby be connected to the connection portions of the external electrodes. The body portions are formed to be spaced apart from virtual lines connecting distal ends of the connection portions and distal ends of the band portions to each other.
公开/授权文献
- US20180020545A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME 公开/授权日:2018-01-18
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