The utility model discloses a semiconductor package and a lead frame thereof. The lead frame (1) comprises a platform (5) for mounting a semiconductor chip (3) thereon, a plurality of leads (6, 7) arranged around the platform, and a plurality of lead interconnection members (such as horizontal bars) (9) for interconnecting the leads, wherein a plurality of through holes (17, 18) are formed to penetrate through the lead frame in a thickness direction relative to the leads or the lead interconnection members, and accordingly, a plurality of cutting lines (A and B) pass through the through holes. Thereby, the leads are cut and are electrically independent mutually. A semiconductor package with a QFN type is produced by enclosing the lead frame in a molded resin element (13), wherein the leads are partially exposed from the molded resin element (13) and are plated and cut at the cutting lines.