A displacement electroless gold plating solution, characterized in that it comprises a non-cyanide water-soluble gold compound and a hydrogensulfite compound. It is preferred that the plating solution further comprises a thiosulfate compound and an amino-carboxylic acid compound. Sodium hydrogensulfite, potassium hydrogensulfite, ammonium hydrogensulfite and the like can be used as the hydrogensulfite compound. The above plating solution is a non-cyanide displacement electroless gold plating solution which is low in the toxicity, can be used at a pH near to neutrality, and exhibits good adhesion to a solder and a coating film.