The invention relates to a repair soldering head (12) which can for example be used to replace structural elements (26). For unsoldering, the structural component (26) is heated by means of a heat transfer medium (16) until the soldered joints (27) between the structural component (26) and the substrate (29) are melted. The heat transfer medium is for example a liquid solder that is guided to thestructural component (26) through a supply line (18) and flows back through return channels (19). The structural component is removed by means of a vacuum connection which allows sucking the structural component (26) on a receptacle (14). The repair soldering head (12) can also be used to remove remaining solder or for soldering a positioning point by means of a specifically provided soldering body and for soldering in structural components.