A material board formed by connecting a plurality of hybrid circuit boards (1), each mounting electronic components (2) and having metallic terminal plates (3) for external connection, boded to project toward outside, integrally with marginal frame parts (6) between the hybrid circuit boards through thin stripes (8) each provided in the middle of a cut groove (7) surrounding the entire circumference of each hybrid circuit board, wherein adhesive (9) does not spread to the forward end part side of a terminal plate (3) when it is bonded temporarily to a marginal frame part (6) with the adhesive in order to bond the terminal plate (3) to the hybrid circuit board by soldering. Punch holes (10) or recesses are provided in that portion of the marginal frame part (6) where the terminal plate (3) overlaps the marginal frame part and which is closer to the forward end part beyond the position of the terminal plate being applied with the adhesive (9) for temporary bonding to the marginal frame part.