The present invention relates to a method for recycling a substrate, especially a wafer, said substrate having a profile with a surface and a collar, wherein an interface provided between said surface and said collar has been formed by a previous separation step, and said profile is further planarised for obtaining a plane surface. In order to provide an improved method of the above-mentioned type which allows a substrate to be reused more often and enables the recycled substrate to be produced with a low total thickness variance, wherein a good planar surface quality is obtained, it is suggested that the method comprises a severing of the collar from said surface and said interface in a separate step.