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发明公开
CN1707779A 半导体装置 有权 转让

半导体装置
摘要：
本发明的半导体装置由于具备在基底材料上配置了多个布线的布线基板、在上述布线基板上搭载的半导体元件、包含混合了金属离子结合剂的材料的与布线接触的构件、或者向表面添加了金属离子结合剂的布线，因此能够防止因金属离子从布线析出而导致的迁移发生，能够提供高可靠性的半导体装置。
摘要（英）：

A high reliability semiconductor device is provided which can prevent electromigration due to the deposition of metal ions originating from wires. The device includes: a flexible wiring board 11 including a base film 1 and multiple wires 9; a semiconductor chip 5 mounted to the flexible wiring board 11; and a sealing resin 6 disposed between the flexible wiring board 11 and the semiconductor chip 5 so as to at least partially in contact with the wires 9. The sealing resin 6 contains a metal ion binder mixed thereto.

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