The object of the present invention is to provide a laminated circuit board with electronic components buried therein wherein the laminated circuit board may assure excellent reliability of electricalconnections and high mechanical strength even with electronic components mounted in high density. It comprises a substrate (1001) on which a land disposed on one main surface thereof is connected andfixed by solder (1007) to integrated circuit (1005) or the like, and a sheet (1011) laminated on the upper surface of the substrate (1001) and also provided with a filling portion by fluid resin formedby clearance (1008) at the outer periphery of integrated circuit (1005) or the like, wherein the sheet (1011) maintains its shape by woven or non-woven cloth having a hole (1012) in which integratedcircuit (1005) or the like is buried, and the woven or non-woven cloth is impregnated with resin (1016) having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.