Disclosed is a semiconductor package and method of fabricating the same. According to the package of the present invention, a semiconductor chip 20 is disposed such that its bonding pad 21 is disposed upwardly. Metal lines 30,31 are deposited along a surface, both sides and a bottom face of the semiconductor chip 20 thereby electrically connecting its upper end 30 to the bonding pad 21 of the semiconductor chip 20. An entire resultant is encapsulated with molding compounds 50,51 such that a lower end of the metal line 31 is exposed thereby forming a ball land. A solder ball 60 is mounted on a portion of the metal line 31 exposed from the molding compound 51.