A pressure sensitive adhesive sheet comprising a substrate, an intermediate layer superimposed thereon and a pressure sensitive adhesive layer superimposed on the intermediate layer, characterized in that the pressure sensitive adhesive layer exhibiting an elastic modulus at 23 DEG C ranging from 5.0 x 10<4> to 1.0 x 10<7> Pa, the intermediate layer exhibiting an elastic modulus at 23 DEG C which is not greater than the elastic modulus at 23 DEG C of the pressure sensitive adhesive layer, or the intermediate layer exhibiting an elastic modulus at 40 DEG C of less than 1.0 x 10<6> Pa. At the time of working of the back of an adherend having a surface whose unevenness height differences are large, this pressure sensitive adhesive sheet is preferably stuck to the adherend surface to thereby protect it during the working. In particular, when the adherend is to be ground to an extremely small thickness, the pressure sensitive adhesive sheet enables performing the grinding at a uniform thickness without the occurrence of dimples.